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Thin Film Materials · TB-PVD-FE

Iron (Fe) Sputtering Targets

Vacuum-melted high-purity iron (Fe, CAS 7439-89-6) planar magnetron sputtering targets in 3N5 (99.95%) / 4N (99.99%) / 4N5 grades for semiconductor, optical, and research PVD.

Alternate & search designations: High-purity iron PVD magnetron target, 3N5 (99.95%) / 4N (99.99%) / 4N5 Fe planar sputter cathode disc, 4N5 pure iron thin magnetic sputter target, Fe spintronic & CNT catalyst target
Purity / Grade Options3N5 (99.95%) / 4N (99.99%) / 4N5
Standard DimensionsØ 1", 2", 3", 4", 6", 8" × Thickness 2–12.7 mm; Rectangular
Available ConfigurationsMonolithic or OFHC Cu / Mo backing plate + Metallic Indium / Elastomer bonding
Ordering & MOQSpecification-based quote · Prototype & production lots

Material & Engineering Overview

High-purity iron (Fe, CAS 7439-89-6) planar sputtering targets are consolidated by vacuum melting or hot isostatic pressing and thermomechanically processed to achieve fine, equiaxed microstructure and ≥99.5%–100% relative density. Controlled grain uniformity and ultra-low dissolved gas content (O, N, H, C) ensure stable DC, pulsed-DC, RF, and HiPIMS plasma impedance with minimal droplet or particle generation across the target erosion track.

Vacuum-induction melted and high-purity electrolytic iron targets are precision ground to 0.5–2.0 mm thickness for reliable magnetron plasma ignition. Each iron target is precision-machined to fit 1-inch (25.4 mm), 2-inch (50.8 mm), 3-inch (76.2 mm), 4-inch (100/101.6 mm), or custom rectangular magnetron cathodes, supplied monolithic or indium-bonded to an OFHC copper backing plate, and vacuum-sealed with a batch GDMS or ICP-OES Certificate of Analysis.

Standard Shipment Documentation: Manufacturer Lot COA (GDMS or ICP-OES trace metallic impurity assay in ppm for Fe, bulk density), dimensional inspection, and indium-bond check if bonded.

Primary Research & Industrial Applications

  • Spintronic spin-valves, FePt / FePd L10 magnetic media, and magneto-optical films
  • Carbon nanotube (CNT) CVD catalyst thin-film seed layers
  • Reactive Fe2O3 / Fe3O4 photoelectrochemical water-splitting photoanodes
  • Soft magnetic thin-film inductor cores

Nominal Material Reference Properties

Property / MetricNominal Reference Value (Grade Dependent)
Chemical Formula & CAS #Fe (CAS 7439-89-6)
Available Purity Tiers3N5 (99.95%) / 4N (99.99%) / 4N5
Theoretical / Bulk Density7.87 g/cm³
Melting Point1,538 °C
Thermal / Magnetic NoteFerromagnetic (Curie temp 770 °C) — specify 0.5–1.5 mm thickness!

Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.

What to Specify in Your Quote Request

Specify iron purity grade (3N5 (99.95%) / 4N (99.99%) / 4N5), target diameter and thickness (e.g., Ø 2.00" × 0.125" or 0.250"), flat edge vs. stepped clamp lip, magnetron gun model, and whether monolithic or indium-bonded to an OFHC copper backing plate is required.

Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.

Prepare Iron (Fe) Sputtering Targets RFQ ↗

Technical & Procurement FAQ

What purity grade of iron (Fe) sputtering target should I select?
Standard 3N5 (99.95%) purity suits general metallization, hard coatings, and adhesion/barrier layers, while higher 4N5–5N grades are recommended for active semiconductor junctions, low-resistivity interconnects, and quantum/optical research.
Should my iron sputtering target be bonded to a copper backing plate?
Vacuum-induction melted and high-purity electrolytic iron targets are precision ground to 0.5–2.0 mm thickness for reliable magnetron plasma ignition. Bonding with metallic indium to an OFHC copper backing plate is recommended for brittle compositions, thin discs, or high-power-density runs (keep cooling water at 18–22 °C so the indium bond stays below 120 °C).
What batch certification ships with TB-PVD-FE?
Every iron target ships vacuum-sealed in an argon/moisture barrier bag accompanied by the producing mill's lot Certificate of Analysis reporting elemental purity and trace metallic impurities in ppm.
Cross-referenced catalog

Related technical materials.

Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.

Metal Sputtering Targets (Ti / Cr / Al / Cu / Ni / W / Mo / Ta, CAS 7440-32-6) — Thin Film Materials studio photographTB-PVD-MT
Thin Film MaterialsTi / Cr / Al / Cu / Ni / W / Mo / Ta · 7440-32-6

Metal Sputtering Targets

Vacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.

Purity / Grade3N5 (99.95%) / 4N (99.99%) / 4N5 / 5N (99.999%)
Typical SizeØ 1", 2", 3", 4", 6", 8" × Thickness 1–12.7 mm; Rectangular plates
Cobalt (Co) Sputtering Targets (Co, CAS 7440-48-4) — Thin Film Materials studio photographTB-PVD-CO
Thin Film MaterialsCo · 7440-48-4

Cobalt (Co) Sputtering Targets

Vacuum-melted high-purity cobalt (Co, CAS 7440-48-4) planar magnetron sputtering targets in 3N5 (99.95%) / 4N (99.99%) / 4N5 grades for semiconductor, optical, and research PVD.

Purity / Grade3N5 (99.95%) / 4N (99.99%) / 4N5
Typical SizeØ 1", 2", 3", 4" × 1.0–2.0 mm (thin magnetic pass-through) or 3–6 mm
Permalloy (Ni80Fe20 & CoFeB) (Ni80Fe20 / Ni81Fe19 / Co40Fe40B20) Sputtering Targets (Ni80Fe20 / Ni81Fe19 / Co40Fe40B20, CAS 12168-54-6) — Thin Film Materials studio photographTB-PVD-NIFE
Thin Film MaterialsNi80Fe20 / Ni81Fe19 / Co40Fe40B20 · 12168-54-6

Permalloy (Ni80Fe20 & CoFeB) (Ni80Fe20 / Ni81Fe19 / Co40Fe40B20) Sputtering Targets

Vacuum-melted high-purity permalloy (Ni80Fe20 & CoFeB) (Ni80Fe20 / Ni81Fe19 / Co40Fe40B20, CAS 12168-54-6) planar magnetron sputtering targets in 3N5 (99.95%) / 4N Vacuum-Induction Melted grades for semiconductor, optical, and research PVD.

Purity / Grade3N5 (99.95%) / 4N Vacuum-Induction Melted
Typical SizeØ 1", 2", 3", 4", 6", 8" × Thickness 2–12.7 mm; Rectangular
Nickel (Ni) Sputtering Targets (Ni, CAS 7440-02-0) — Thin Film Materials studio photographTB-PVD-NI
Thin Film MaterialsNi · 7440-02-0

Nickel (Ni) Sputtering Targets

Vacuum-melted high-purity nickel (Ni, CAS 7440-02-0) planar magnetron sputtering targets in 4N (99.99%) / 4N5 (99.995%) / 5N grades for semiconductor, optical, and research PVD.

Purity / Grade4N (99.99%) / 4N5 (99.995%) / 5N
Typical SizeØ 1", 2", 3", 4" × 1.0–2.0 mm (thin magnetic pass-through) or 3–6 mm
Custom & catalog specifications

Need pricing, lead time, or custom dimensions?

Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.

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