Vacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.
Consistent thin-film sheet resistance, stress, and step coverage start with controlled target metallurgy: vacuum induction or electron-beam melted ingots thermomechanically rolled and recrystallized to fine, uniform grain sizes (<30–100 µm) with minimal trapped gas. We supply non-precious pure metals (Ti, Cr, Al, Cu, Ni, Co, Fe, V, W, Mo, Ta, Nb, Zr, Hf, Si, Ge, Sn, Bi, Zn) and binary/ternary alloys across 1-inch to 8-inch circular and rectangular cathode formats.
Targets are supplied monolithic or indium-/elastomer-bonded to OFHC copper or molybdenum backing plates, vacuum-sealed in argon/nitrogen barrier bags with lot GDMS or ICP-OES trace-element COA.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Purity Tiers | 99.95% (3N5), 99.99% (4N), 99.995% (4N5), 99.999% (5N) |
| Relative Density | ≥99.5%–100% wrought vacuum-melted density |
| Average Grain Size | Controlled fine equiaxed (<50–100 µm typical) |
| Standard Research Diameters | 25.4 mm (1"), 50.8 mm (2"), 76.2 mm (3"), 100/101.6 mm (4") |
| Bonding Options | Metallic Indium (>95% wet coverage) or High-Temp Silver Elastomer |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify element or atomic/weight-% alloy composition, purity (e.g., 4N vs. 5N), exact diameter and thickness (note thinner 1–2 mm requirement for ferromagnetic Ni/Fe/Co targets!), flat edge vs. stepped clamp lip, sputter gun model (Lesker Torus, AJA, Angstrom, Ulvac, Denton), and backing/bonding needs.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Metal Sputtering Targets RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-OXHigh-density hot-pressed and HIP-consolidated oxide, nitride, carbide, and sulfide ceramic sputtering targets (ITO, AZO, ZnO, Al2O3, SiO2, TiO2, BaTiO3) indium-bonded for arc-free RF/pulsed-DC PVD.
TB-PVD-EVVacuum-degassed 4N–5N metal evaporation slugs/shots and optical dielectric granules (SiO2, Ti3O5, MgF2, Al2O3) engineered for spit-free e-beam and thermal PVD.
TB-PVD-LNPrecision-tapered e-beam gun hearth liners in OFHC copper, purified & impermeable graphite, vitreous carbon, molybdenum, tungsten, alumina, and h-BN.
TB-PVD-QCMPrecision 6.0 MHz and 5.0 MHz AT-cut plano-convex quartz crystal microbalance (QCM) thickness monitor sensors with gold or stress-relieving alloy electrodes in cleanroom dispenser packs.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.