High-density hot-pressed barium titanate & barium strontium titanate (BaTiO3 / Ba1-xSrxTiO3 (BST), CAS 12047-27-7) ceramic sputtering targets in 3N5 (99.95%) / 4N purity, indium-bonded for arc-free RF and pulsed-DC thin-film deposition.
Sintered by vacuum hot-pressing or Hot Isostatic Pressing (HIP) from sub-micron 3N5 (99.95%) / 4N precursor powders, our barium titanate & barium strontium titanate (BaTiO3 / Ba1-xSrxTiO3 (BST), CAS 12047-27-7) sputtering targets achieve high relative density (typically 96%–99.5% of 5.85 g/cm³ theoretical density) and homogeneous phase stoichiometry. High density suppresses outgassing, surface nodule formation, and plasma arcing during RF magnetron or reactive pulsed-DC sputtering.
Hot-pressed perovskite BaTiO3 and tunable Ba0.5Sr0.5TiO3 / Ba0.6Sr0.4TiO3 targets enable RF deposition of high-permittivity (εr 200–1,000+) ferroelectric thin films. Because ceramic targets have low thermal conductivity and limited thermal-shock resistance, we strongly recommend ordering BaTiO3 / Ba1-xSrxTiO3 (BST) targets metallic-indium bonded to an OFHC copper backing plate. Each target ships vacuum-packed with its batch chemical assay and density COA.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Formula & CAS # | BaTiO3 / Ba1-xSrxTiO3 (BST) (CAS 12047-27-7) |
| Purity Grades | 3N5 (99.95%) / 4N |
| Bulk / Theoretical Density | 5.85 g/cm³ (≥96%–99.5% relative density) |
| Recommended Bonding | Metallic Indium bond to OFHC Cu backing plate (<120 °C max run temp) |
| Recommended Power Ramp | RF / Pulsed-DC ramp at 5–10 W/min with ≥2–4 L/min cooling water |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify BaTiO3 / Ba1-xSrxTiO3 (BST) purity (3N5 (99.95%) / 4N), exact dopant weight/mole ratio if applicable, ceramic disc diameter × thickness (e.g., Ø 50.8 × 3.175 mm), backing-plate geometry, and sputtering chamber gun model.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Barium Titanate & Barium Strontium Titanate (BaTiO3 / Ba1-xSrxTiO3 (BST)) Sputtering Targets RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-OXHigh-density hot-pressed and HIP-consolidated oxide, nitride, carbide, and sulfide ceramic sputtering targets (ITO, AZO, ZnO, Al2O3, SiO2, TiO2, BaTiO3) indium-bonded for arc-free RF/pulsed-DC PVD.
TB-PVD-PZTHigh-density hot-pressed lead zirconate titanate (PZT 52/48) (Pb(Zr0.52Ti0.48)O3 (+10–20 mol% excess PbO), CAS 12626-81-2) ceramic sputtering targets in 3N5 (99.95%) purity, indium-bonded for arc-free RF and pulsed-DC thin-film deposition.
TB-SUB-STOEpi-ready CMP-polished strontium titanate (SrTiO3 & Nb:STO) Single-Crystal substrates (SrTiO3 / Nb:SrTiO3, CAS 12060-59-2) wafers and diced research squares with sub-nanometer surface roughness for PVD, PLD, MBE, and ALD.
TB-SUB-MGOEpi-ready CMP-polished magnesium oxide (MgO) Single-Crystal substrates (MgO, CAS 1309-48-4) wafers and diced research squares with sub-nanometer surface roughness for PVD, PLD, MBE, and ALD.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.