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Thin Film Materials · TB-PVD-CR

Chromium (Cr) Sputtering Targets

Vacuum-melted high-purity chromium (Cr, CAS 7440-47-3) planar magnetron sputtering targets in 3N5 (99.95%) / 4N (99.99%) / 4N5 grades for semiconductor, optical, and research PVD.

Alternate & search designations: High-purity chromium PVD magnetron target, 3N5 (99.95%) / 4N (99.99%) / 4N5 Cr planar sputter cathode disc, HIP chromium PVD target, photomask Cr sputter disc
Purity / Grade Options3N5 (99.95%) / 4N (99.99%) / 4N5
Standard DimensionsØ 1", 2", 3", 4", 6", 8" × Thickness 2–12.7 mm; Rectangular
Available ConfigurationsMonolithic or OFHC Cu / Mo backing plate + Metallic Indium / Elastomer bonding
Ordering & MOQSpecification-based quote · Prototype & production lots

Material & Engineering Overview

High-purity chromium (Cr, CAS 7440-47-3) planar sputtering targets are consolidated by vacuum melting or hot isostatic pressing and thermomechanically processed to achieve fine, equiaxed microstructure and ≥99.5%–100% relative density. Controlled grain uniformity and ultra-low dissolved gas content (O, N, H, C) ensure stable DC, pulsed-DC, RF, and HiPIMS plasma impedance with minimal droplet or particle generation across the target erosion track.

HIP-consolidated fine-grain chromium targets are recommended with metallic indium bonding to an OFHC copper backing plate for high-wattage runs. Each chromium target is precision-machined to fit 1-inch (25.4 mm), 2-inch (50.8 mm), 3-inch (76.2 mm), 4-inch (100/101.6 mm), or custom rectangular magnetron cathodes, supplied monolithic or indium-bonded to an OFHC copper backing plate, and vacuum-sealed with a batch GDMS or ICP-OES Certificate of Analysis.

Standard Shipment Documentation: Manufacturer Lot COA (GDMS or ICP-OES trace metallic impurity assay in ppm for Cr, bulk density), dimensional inspection, and indium-bond check if bonded.

Primary Research & Industrial Applications

  • Photomask absorber layers (Cr / CrOx) and glass/quartz adhesion layers before Au or Cu
  • Hard decorative and corrosion-resistant CrN / Cr2O3 PVD coatings
  • Thin-film strain gauges and microelectronic lift-off stacks
  • Optical black-chrome and beam-splitter mirror coatings

Nominal Material Reference Properties

Property / MetricNominal Reference Value (Grade Dependent)
Chemical Formula & CAS #Cr (CAS 7440-47-3)
Available Purity Tiers3N5 (99.95%) / 4N (99.99%) / 4N5
Theoretical / Bulk Density7.19 g/cm³
Melting Point1,907 °C
Thermal / Magnetic NoteAntiferromagnetic (sputters as non-magnetic); CTE 4.9 × 10⁻⁶ /K

Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.

What to Specify in Your Quote Request

Specify chromium purity grade (3N5 (99.95%) / 4N (99.99%) / 4N5), target diameter and thickness (e.g., Ø 2.00" × 0.125" or 0.250"), flat edge vs. stepped clamp lip, magnetron gun model, and whether monolithic or indium-bonded to an OFHC copper backing plate is required.

Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.

Prepare Chromium (Cr) Sputtering Targets RFQ ↗

Technical & Procurement FAQ

What purity grade of chromium (Cr) sputtering target should I select?
Standard 3N5 (99.95%) purity suits general metallization, hard coatings, and adhesion/barrier layers, while higher 4N5–5N grades are recommended for active semiconductor junctions, low-resistivity interconnects, and quantum/optical research.
Should my chromium sputtering target be bonded to a copper backing plate?
HIP-consolidated fine-grain chromium targets are recommended with metallic indium bonding to an OFHC copper backing plate for high-wattage runs. Bonding with metallic indium to an OFHC copper backing plate is recommended for brittle compositions, thin discs, or high-power-density runs (keep cooling water at 18–22 °C so the indium bond stays below 120 °C).
What batch certification ships with TB-PVD-CR?
Every chromium target ships vacuum-sealed in an argon/moisture barrier bag accompanied by the producing mill's lot Certificate of Analysis reporting elemental purity and trace metallic impurities in ppm.
Cross-referenced catalog

Related technical materials.

Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.

Metal Sputtering Targets (Ti / Cr / Al / Cu / Ni / W / Mo / Ta, CAS 7440-32-6) — Thin Film Materials studio photographTB-PVD-MT
Thin Film MaterialsTi / Cr / Al / Cu / Ni / W / Mo / Ta · 7440-32-6

Metal Sputtering Targets

Vacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.

Purity / Grade3N5 (99.95%) / 4N (99.99%) / 4N5 / 5N (99.999%)
Typical SizeØ 1", 2", 3", 4", 6", 8" × Thickness 1–12.7 mm; Rectangular plates
Chromium (Cr) Evaporation Materials (Cr, CAS 7440-47-3) — Thin Film Materials studio photographTB-EV-CR
Thin Film MaterialsCr · 7440-47-3

Chromium (Cr) Evaporation Materials

Vacuum-degassed 4N (99.99%) / 4N5 (99.995%) chromium (Cr, CAS 7440-47-3) evaporation pellets, granules, and slugs engineered for spit-free electron-beam and resistive thermal PVD.

Purity / Grade4N (99.99%) / 4N5 (99.995%)
Typical Size1–3 mm & 2–5 mm degassed chunks/granules; Cr-plated W evaporation rods
Titanium (Ti) Sputtering Targets (Ti, CAS 7440-32-6) — Thin Film Materials studio photographTB-PVD-TI
Thin Film MaterialsTi · 7440-32-6

Titanium (Ti) Sputtering Targets

Vacuum-melted high-purity titanium (Ti, CAS 7440-32-6) planar magnetron sputtering targets in 4N (99.99%) / 4N5 (99.995%) / 5N grades for semiconductor, optical, and research PVD.

Purity / Grade4N (99.99%) / 4N5 (99.995%) / 5N
Typical SizeØ 1", 2", 3", 4", 6", 8" × Thickness 2–12.7 mm; Rectangular
UV Fused Silica & Optical Quartz Windows (SiO2, CAS 60676-86-0) — Fused Quartz & Substrates studio photographTB-SIO2-WN
Fused Quartz & SubstratesSiO2 · 60676-86-0

UV Fused Silica & Optical Quartz Windows

Precision double-side optically polished UV synthetic fused silica (JGS1), optical quartz (JGS2), and full-spectrum IR fused silica (JGS3) windows and wafer substrates.

Purity / GradeJGS1 (Deep-UV 185–2,100 nm) / JGS2 (UV-VIS) / JGS3 (IR Low-OH)
Typical SizeØ 5–200 mm or Square 5×5 to 150×150 mm × Thickness 0.2–20 mm
Custom & catalog specifications

Need pricing, lead time, or custom dimensions?

Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.

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