Vacuum-melted high-purity copper (Cu, CAS 7440-50-8) planar magnetron sputtering targets in 4N5 (99.995%) / 5N (99.999%) / 6N OFHC grades for semiconductor, optical, and research PVD.
High-purity copper (Cu, CAS 7440-50-8) planar sputtering targets are consolidated by vacuum melting or hot isostatic pressing and thermomechanically processed to achieve fine, equiaxed microstructure and ≥99.5%–100% relative density. Controlled grain uniformity and ultra-low dissolved gas content (O, N, H, C) ensure stable DC, pulsed-DC, RF, and HiPIMS plasma impedance with minimal droplet or particle generation across the target erosion track.
Oxygen-free high-purity wrought copper targets support very high DC power densities monolithically without cracking. Each copper target is precision-machined to fit 1-inch (25.4 mm), 2-inch (50.8 mm), 3-inch (76.2 mm), 4-inch (100/101.6 mm), or custom rectangular magnetron cathodes, supplied monolithic or indium-bonded to an OFHC copper backing plate, and vacuum-sealed with a batch GDMS or ICP-OES Certificate of Analysis.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Chemical Formula & CAS # | Cu (CAS 7440-50-8) |
| Available Purity Tiers | 4N5 (99.995%) / 5N (99.999%) / 6N OFHC |
| Theoretical / Bulk Density | 8.96 g/cm³ |
| Melting Point | 1,085 °C |
| Thermal / Magnetic Note | Diamagnetic; Ultra-high thermal conductivity 401 W/m·K |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify copper purity grade (4N5 (99.995%) / 5N (99.999%) / 6N OFHC), target diameter and thickness (e.g., Ø 2.00" × 0.125" or 0.250"), flat edge vs. stepped clamp lip, magnetron gun model, and whether monolithic or indium-bonded to an OFHC copper backing plate is required.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Copper (Cu) Sputtering Targets RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-MTVacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.
TB-EV-CUVacuum-degassed 5N (99.999%) / 6N OFHC copper (Cu, CAS 7440-50-8) evaporation pellets, granules, and slugs engineered for spit-free electron-beam and resistive thermal PVD.
TB-MO-SHHigh-purity 3N5 (99.95%) / 4N (99.99%) Cross-Rolled & Annealed High-Purity molybdenum (mo) foil, sheet, plate & discs (Mo, CAS 7439-98-7) engineered for ultra-high-temperature vacuum furnaces, crystal growth, semiconductor processing, and corrosive environments.
TB-AL2O3-PLThin tape-cast electronic substrates (96% / 99.6%) and thick precision-ground alumina setter and wear plates with optional laser cutting or CNC machining.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.