Vacuum-degassed 5N (99.999%) / 6N OFHC copper (Cu, CAS 7440-50-8) evaporation pellets, granules, and slugs engineered for spit-free electron-beam and resistive thermal PVD.
Prepared specifically for high-vacuum electron-beam and resistive thermal evaporation, our 5N (99.999%) / 6N OFHC copper (Cu, CAS 7440-50-8) deposition materials undergo vacuum degassing or high-temperature sintering to eliminate trapped volatiles and micro-voids that cause melt spitting and pinhole film defects.
Use molybdenum, graphite, vitreous carbon, or Al2O3 e-beam liners, or molybdenum/alumina-coated tungsten resistive boats. Supplied in cleanroom argon-flushed containers by weight (50 g to 1,000 g lots) or piece count, accompanied by the manufacturer's batch trace-impurity Certificate of Analysis.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Formula & CAS # | Cu (CAS 7440-50-8) |
| Purity Tiers | 5N (99.999%) / 6N OFHC |
| Density & Melting/Sublimation | 8.96 g/cm³ · MP/Subl. ~1,085 °C |
| Standard Forms | Ø 3×3 mm & Ø 6×6 mm oxygen-free cylindrical slugs; 2–5 mm shot |
| Recommended Liner / Boat | Use molybdenum, graphite, vitreous carbon, or Al2O3 e-beam liners, or molybdenum/alumina-coated tungsten resistive boats |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify Cu purity (5N (99.999%) / 6N OFHC), preferred pellet or granule size (Ø 3×3 mm & Ø 6×6 mm oxygen-free cylindrical slugs; 2–5 mm shot), deposition method (e-beam hearth pocket cc volume vs. resistive W/Mo/Ta boat), and pack weight in grams.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Copper (Cu) Evaporation Materials RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-EVVacuum-degassed 4N–5N metal evaporation slugs/shots and optical dielectric granules (SiO2, Ti3O5, MgF2, Al2O3) engineered for spit-free e-beam and thermal PVD.
TB-PVD-CUVacuum-melted high-purity copper (Cu, CAS 7440-50-8) planar magnetron sputtering targets in 4N5 (99.995%) / 5N (99.999%) / 6N OFHC grades for semiconductor, optical, and research PVD.
TB-PVD-LNPrecision-tapered e-beam gun hearth liners in OFHC copper, purified & impermeable graphite, vitreous carbon, molybdenum, tungsten, alumina, and h-BN.
TB-PVD-BT99.95% pure tungsten, molybdenum, and tantalum resistive thermal evaporation boats, baffled box sources, and stranded tungsten wire baskets/coils.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.