Semiconductor-grade 99.995% clear fused quartz beakers, rectangular wafer wet-bench tanks, and flanged vacuum bell jars with sub-ppm metallic leaching and extreme thermal-shock immunity.
Flame-worked from 4N5+ fused quartz tubing and boules, our analytical quartz labware introduces virtually zero Na, K, Fe, Cu, or B background contamination during trace-metal acid digestions, RCA wafer cleaning, and high-temperature phosphor or battery-cathode calcination.
With a thermal expansion coefficient of just 0.55 × 10⁻⁶ /K, fused quartz crucibles and dishes withstand rapid heating and air quenching up to 1,150 °C without cracking.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Material Purity | ≥ 99.995% SiO2 (< 15–20 ppm total metallic impurities) |
| Continuous / Peak Temp | 1,100 °C Continuous / 1,250 °C Short-Term |
| Thermal Shock Tolerance | Withstands 1,000 °C → Water Quench |
| Acid Resistance | Inert to all acids except HF and hot H3PO4 (>300 °C) |
| Available Forms | Tall/Low-Form Crucibles, Beakers, Dishes, Flasks, & Bell Jars |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify vessel type (crucible, beaker, evaporating dish, or flanged bell jar), nominal volume (mL/L) or OD × height × wall thickness, lid style, and quantity.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Semiconductor Fused Quartz Beakers, Wet-Bench Tanks & Vacuum Bell Jars RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-SIO2-TUOptically clear 99.99% (4N) fused quartz process tubes for CVD graphene/2D growth, semiconductor diffusion, photochemistry, and rapid-quench tube furnaces up to 1,150 °C.
TB-SIO2-BTUltra-clean 99.99% fused quartz combustion boats, lidded CVD precursor sleds, and precision-slotted wafer carriers for contamination-free thermal processing.
TB-SIO2-WNPrecision double-side optically polished UV synthetic fused silica (JGS1), optical quartz (JGS2), and full-spectrum IR fused silica (JGS3) windows and wafer substrates.
TB-SIO2-CVDirect thermally fused (adhesive-free) JGS1 UV-VIS-NIR quartz spectrophotometer and fluorometer cuvettes with >80% transmission from 190 nm to 2,500 nm and matched pair transmission within ≤0.5%.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.