Vacuum-melted high-purity Nickel-Chromium (NiCr 80/20) (NiCr (80:20 / 60:40 / 50:50 wt%), CAS 11106-97-1) planar magnetron sputtering targets in 3N5 (99.95%) / 4N grades for semiconductor, optical, and research PVD.
High-purity Nickel-Chromium (NiCr 80/20) (NiCr (80:20 / 60:40 / 50:50 wt%), CAS 11106-97-1) planar sputtering targets are consolidated by vacuum melting or hot isostatic pressing and thermomechanically processed to achieve fine, equiaxed microstructure and ≥99.5%–100% relative density. Controlled grain uniformity and ultra-low dissolved gas content (O, N, H, C) ensure stable DC, pulsed-DC, RF, and HiPIMS plasma impedance with minimal droplet or particle generation across the target erosion track.
Unlike pure nickel, Nichrome 80:20 wt% is non-magnetic at room temperature, allowing thick standard targets (3–6.35 mm) on conventional magnetrons! Each Nickel-Chromium (NiCr 80/20) target is precision-machined to fit 1-inch (25.4 mm), 2-inch (50.8 mm), 3-inch (76.2 mm), 4-inch (100/101.6 mm), or custom rectangular magnetron cathodes, supplied monolithic or indium-bonded to an OFHC copper backing plate, and vacuum-sealed with a batch GDMS or ICP-OES Certificate of Analysis.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Chemical Formula & CAS # | NiCr (80:20 / 60:40 / 50:50 wt%) (CAS 11106-97-1) |
| Available Purity Tiers | 3N5 (99.95%) / 4N |
| Theoretical / Bulk Density | 8.40 g/cm³ |
| Melting Point | 1,400 °C |
| Thermal / Magnetic Note | Non-magnetic (80:20 wt% is paramagnetic at RT!); Low TCR <±25 ppm/K |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify Nickel-Chromium (NiCr 80/20) purity grade (3N5 (99.95%) / 4N), target diameter and thickness (e.g., Ø 2.00" × 0.125" or 0.250"), flat edge vs. stepped clamp lip, magnetron gun model, and whether monolithic or indium-bonded to an OFHC copper backing plate is required.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Nickel-Chromium (NiCr 80/20) (NiCr (80:20 / 60:40 / 50:50 wt%)) Sputtering Targets RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-MTVacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.
TB-PVD-CRVacuum-melted high-purity chromium (Cr, CAS 7440-47-3) planar magnetron sputtering targets in 3N5 (99.95%) / 4N (99.99%) / 4N5 grades for semiconductor, optical, and research PVD.
TB-PVD-NIVacuum-melted high-purity nickel (Ni, CAS 7440-02-0) planar magnetron sputtering targets in 4N (99.99%) / 4N5 (99.995%) / 5N grades for semiconductor, optical, and research PVD.
TB-AL2O3-PLThin tape-cast electronic substrates (96% / 99.6%) and thick precision-ground alumina setter and wear plates with optional laser cutting or CNC machining.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.