TB-PVD-MTMetal Sputtering Targets
Vacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.
Vacuum-melted high-purity zirconium (Zr, CAS 7440-67-7) planar magnetron sputtering targets in 3N5 (99.95% Grade 702) / 4N Low-Hf (<100 ppm Hf) grades for semiconductor, optical, and research PVD.
High-purity zirconium (Zr, CAS 7440-67-7) planar sputtering targets are consolidated by vacuum melting or hot isostatic pressing and thermomechanically processed to achieve fine, equiaxed microstructure and ≥99.5%–100% relative density. Controlled grain uniformity and ultra-low dissolved gas content (O, N, H, C) ensure stable DC, pulsed-DC, RF, and HiPIMS plasma impedance with minimal droplet or particle generation across the target erosion track.
Available in standard crystal-bar/sponge 3N5 purity as well as nuclear/semiconductor low-hafnium (<50–100 ppm Hf) 4N grades. Each zirconium target is precision-machined to fit 1-inch (25.4 mm), 2-inch (50.8 mm), 3-inch (76.2 mm), 4-inch (100/101.6 mm), or custom rectangular magnetron cathodes, supplied monolithic or indium-bonded to an OFHC copper backing plate, and vacuum-sealed with a batch GDMS or ICP-OES Certificate of Analysis.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Chemical Formula & CAS # | Zr (CAS 7440-67-7) |
| Available Purity Tiers | 3N5 (99.95% Grade 702) / 4N Low-Hf (<100 ppm Hf) |
| Theoretical / Bulk Density | 6.51 g/cm³ |
| Melting Point | 1,855 °C |
| Thermal / Magnetic Note | Paramagnetic; Low thermal neutron capture & high getter activity |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify zirconium purity grade (3N5 (99.95% Grade 702) / 4N Low-Hf (<100 ppm Hf)), target diameter and thickness (e.g., Ø 2.00" × 0.125" or 0.250"), flat edge vs. stepped clamp lip, magnetron gun model, and whether monolithic or indium-bonded to an OFHC copper backing plate is required.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Zirconium (Zr) Sputtering Targets RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-PVD-MTVacuum-melted and thermomechanically forged pure metal and custom alloy planar sputtering targets (3N5–5N) sized for research and production magnetron cathodes.
TB-PVD-ZRO2High-density hot-pressed zirconium dioxide & YSZ (ZrO2 / 8 mol% Y2O3-ZrO2, CAS 1314-23-4) ceramic sputtering targets in 4N (99.99%) purity, indium-bonded for arc-free RF and pulsed-DC thin-film deposition.
TB-PVD-HFVacuum-melted high-purity hafnium (Hf, CAS 7440-58-6) planar magnetron sputtering targets in 3N5 (99.95% excl. Zr) / 4N Low-Zr grades for semiconductor, optical, and research PVD.
TB-ZR-MLHigh-purity ASTM B551 Zr 702 (99.2% Zr+Hf) & Low-Hafnium 3N5 (<100 ppm Hf) Research Grade zirconium (zr 702 & Low-Hf 3N5) crucibles, foil, sheet, rod & wire (Zr, CAS 7440-67-7) engineered for ultra-high-temperature vacuum furnaces, crystal growth, semiconductor processing, and corrosive environments.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.