Precision-planarity microporous alumina and silicon carbide ceramic plates (1–100 µm pore size) for semiconductor wafer vacuum chucks, air bearings, and high-temperature filtration.
Sintered with narrowly graded pore-forming templates and diamond surface-ground to micron-level flatness, our microporous alumina (Al2O3) and silicon carbide (SiC) plates distribute vacuum hold-down force or pressurized air films uniformly across their entire surface without localized dimple distortion.
Available as standalone porous discs/blocks or hermetically co-fired/bonded into a dense ceramic housing with vacuum ports for 2-inch through 12-inch (300 mm) wafer dicing, thinning, inspection, and lithography stages.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Materials | 99% Al2O3 or Recrystallized/Bonded SiC |
| Mean Pore Diameter | 1–5 µm, 10–20 µm, 30–50 µm, or 60–100 µm |
| Open Porosity | 32% – 45% |
| Surface Flatness / Parallelism | ≤ 2 – 5 µm across Ø 150–200 mm |
| Max Temp (Unbonded Disc) | 1,200 – 1,500 °C |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify wafer or plate diameter × thickness, target pore size (µm), standalone porous disc vs. dense-ring vacuum chuck assembly, and flatness requirement.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Microporous Alumina & SiC Ceramic Plates, Filters & Wafer Vacuum Chucks RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-AL2O3-PLThin tape-cast electronic substrates (96% / 99.6%) and thick precision-ground alumina setter and wear plates with optional laser cutting or CNC machining.
TB-SIC-CMPExtreme-hardness sintered silicon carbide (SSiC) and thermal-shock-proof silicon nitride (Si3N4) wear components, kiln furniture, seal rings, and molten-metal hardware.
TB-SUB-SIEpi-ready CMP-polished silicon wafers & thermal oxide (SiO2/Si) substrates (Si / SiO2-on-Si, CAS 7440-21-3) wafers and diced research squares with sub-nanometer surface roughness for PVD, PLD, MBE, and ALD.
TB-SIO2-FRSintered porous fused quartz fritted discs (porosities G0–G5, 2–250 µm), precision centerless-ground quartz rods, and micro-capillary tubing for plug-flow catalyst reactors and gas sparging.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.