TB-AL2O3-PLAlumina Ceramic Plates
Thin tape-cast electronic substrates (96% / 99.6%) and thick precision-ground alumina setter and wear plates with optional laser cutting or CNC machining.
High-purity Vacuum Cu-Infiltrated Composite (Zero Open Porosity, Hermetic) Tungsten-Copper (WCu) & Molybdenum-Copper (MoCu) thermal submounts & electrodes (WCu (90/10, 80/20, 75/25) & MoCu (85/15, 70/30), CAS 7440-33-7) engineered for ultra-high-temperature vacuum furnaces, crystal growth, semiconductor processing, and corrosive environments.
Consolidated by powder metallurgy, vacuum arc remelting (VAR), or electron-beam melting and stress-relieved for high-temperature dimensional stability, our Tungsten-Copper (WCu) & Molybdenum-Copper (MoCu) thermal submounts & electrodes (WCu (90/10, 80/20, 75/25) & MoCu (85/15, 70/30), CAS 7440-33-7) products deliver reliable performance in vacuum, inert-gas, and reducing furnace atmospheres.
By infiltrating a porous sintered tungsten or molybdenum skeleton with oxygen-free copper, WCu and MoCu composites combine tunable low thermal expansion (CTE 6.5–11.5 ppm/K, matching GaN/SiC, GaAs, AlN, and Al2O3) with high thermal conductivity (180–240 W/m·K). Every shipment includes the producing mill's chemical purity Certificate of Analysis (reporting metallic and interstitial O, N, C, H trace levels in ppm) and pre-shipment dimensional verification.
| Property / Metric | Nominal Reference Value (Grade Dependent) |
|---|---|
| Composition & CAS # | WCu (90/10, 80/20, 75/25) & MoCu (85/15, 70/30) (CAS 7440-33-7) |
| Purity / Alloy Grade | Vacuum Cu-Infiltrated Composite (Zero Open Porosity, Hermetic) |
| Density | 14.5–17.0 (WCu) / 9.7–10.0 (MoCu) g/cm³ |
| Melting Point | Cu phase 1,085 / W skeleton 3,422 °C |
| Available Mill & Machined Forms | Plates, Sheets (0.25–25 mm), Rods, & CNC-Machined Ni/Au-Plated RF Flanges |
Reference values reflect typical sintered, fused, or wrought grades. Exact batch test figures are confirmed on your written quotation and accompanying lot Certificate of Analysis.
Specify WCu (90/10, 80/20, 75/25) & MoCu (85/15, 70/30) purity or alloy grade (Vacuum Cu-Infiltrated Composite (Zero Open Porosity, Hermetic)), form and dimensions (Plates, Sheets (0.25–25 mm), Rods, & CNC-Machined Ni/Au-Plated RF Flanges), surface finish (rolled, ground, electropolished, or chemically cleaned), and quantity.
Include target quantity, destination country/postal code for express air freight calculation, and any special cleanroom bagging or certification requests.
Prepare Tungsten-Copper (WCu) & Molybdenum-Copper (MoCu) Thermal Submounts & Electrodes RFQ ↗Complementary furnaceware, substrates, PVD consumables, and refractory hardware frequently ordered together.
TB-AL2O3-PLThin tape-cast electronic substrates (96% / 99.6%) and thick precision-ground alumina setter and wear plates with optional laser cutting or CNC machining.
TB-W-CMPUltra-high-melting-point (3,422 °C) 99.95%+ pure tungsten crucibles, centerless-ground rods, rolled sheets, wire, and hot-zone elements for extreme vacuum thermal systems.
TB-MO-CMP99.95% pure molybdenum, lanthanated Mo-La, and TZM alloy sintering boats, rolled sheets, rods, crucibles, fasteners, and carbon-free vacuum furnace heat shields.
TB-SUB-SICEpi-ready CMP-polished Single-Crystal 4H-SiC & 6H-SiC wafers & substrates (SiC (4H / 6H), CAS 409-21-2) wafers and diced research squares with sub-nanometer surface roughness for PVD, PLD, MBE, and ALD.
Submit your purity grade, geometry, quantity, and documentation requirements. Every order includes the producing mill's batch Certificate of Analysis (COA) and pre-shipment dimensional verification.